Common component packages

Through-Hole Component Packages

PDIP (Plastic Dual Inline Package)

Two parallel rows of pins extending from the bottom of a plastic body. The number indicates the total number of pins (e.g., PDIP-8 has 8 pins). Widely used for ICs like microcontrollers, op-amps, and logic chips.

Variants: PDIP-6, PDIP-8, PDIP-14, PDIP-16, PDIP-18, PDIP-20, PDIP-24, PDIP-28, PDIP-40, etc.
Pin spacing: 0.1 inches (2.54 mm)
Common applications: Microchips, timers (e.g., 555), and memory ICs

SIP (Single Inline Package)

Fig.: Example of a SIP-4 package component

A single row of pins, often used for resistor networks, transistor arrays, or simple ICs.

Variants: SIP-3, SIP-4, SIP-5, etc.
Pin spacing: 0.1 inches (2.54 mm)
Common applications: Resistor packs, optocouplers, and voltage regulators

TO (Transistor Outline) Packages

Fig.: Example of TO packages; left: TO-220; right: TO-92

TO-92	Small, three-pin package (typically for emitter, base, collector) used for transistors and small ICs. Common applications: BJTs, MOSFETs, voltage regulators (e.g., 78L05).
TO-220	Three or more pins with a metal tab for heat dissipation, often used for power components. Common applications: Voltage regulators (e.g., LM317), power transistors, and MOSFETs.
TO-3	Metal can with two or more pins, used for high-power components. Common applications: High-power transistors, voltage regulators.
TO-18 and TO-5	Small metal cans with 3–8 pins in a circular arrangement. Common applications: Transistors, small ICs, and sensors.

Axial Lead Packages

Fig.: Example of Axial Lead Package (here: Diode 1N4148)

Cylindrical components with leads extending from both ends along the axis.

Common components: Resistors, capacitors (electrolytic, ceramic), diodes (e.g., 1N4148, 1N4007)
Variants: Various sizes depending on power rating (e.g., 1/4W, 1/2W resistors).
Common applications: General-purpose passives and rectifiers.

Radial Lead Packages

Fig.: Example of Radial Lead Package (here: Electrolytic capacitor)

Components with two leads extending from the bottom of the body, parallel to each other.

Common components: Electrolytic capacitors, ceramic disc capacitors, LEDs.
Variants: Vary in body size and lead spacing (e.g., 2 mm, 5 mm, 10 mm).
Common applications: Power supply filtering, LED indicators.

DIP Switch Packages

Similar to PDIP but used for manual switches, with 4, 8, or 10 pins typically.

Pin spacing: 0.1 inches (2.54 mm).
Common applications: Configuration settings on circuit boards.

PGA (Pin Grid Array)

Fig.: Example of PGA package (Pin Grid Array)

A grid of pins on the bottom of a square or rectangular package, used for high-pin-count ICs.

Variants: Common in older microprocessors and large ICs.
Pin spacing: Varies, often 0.1 inches (2.54 mm).
Common applications: CPUs, microcontrollers (less common today).

Zig-Zag Inline Package (ZIP)

Similar to SIP but with pins arranged in a zigzag pattern to save space.

Common applications: Memory modules, specialized ICs.

Common SMD Package Types

Surface-mount device (SMD) components come in various package types, standardized for automated assembly and compact designs.

Resistors, Capacitors, and Inductors

Chip Packages (Rectangular)

0201 (0.6 x 0.3 mm): Ultra-small, used in compact devices.
0402 (1.0 x 0.5 mm): Common in mobile devices.
0603 (1.6 x 0.8 mm): Widely used for general-purpose applications.
0805 (2.0 x 1.25 mm): Common for prototyping and consumer electronics.
1206 (3.2 x 1.6 mm): Larger, easier to handle manually.
1210 (3.2 x 2.5 mm): Used for higher power ratings.
1812 (4.5 x 3.2 mm): For high-capacitance or high-power needs.
2512 (6.3 x 3.2 mm): High-power resistors or large capacitors.

Diodes and LEDs

SOD (Small Outline Diode)

SOD-123: Common for small diodes, single-lead configuration.
SOD-323: Smaller footprint for compact designs.
SOD-523: Ultra-small for space-constrained applications.

Other Diode Packages

SMA, SMB, SMC: Larger diode packages for higher power (e.g., rectifiers).

LED Packages

0603, 0805, 1206: Similar to chip packages, used for compact LEDs.
PLCC (Plastic Leaded Chip Carrier): PLCC-2, PLCC-4 for larger, brighter LEDs.

Transistors and Small ICs

SOT (Small Outline Transistor)

SOT-23: 3-pin (or 5/6-pin variants), widely used for MOSFETs, BJTs.
SOT-89: Larger, for higher power transistors.
SOT-223: For medium-power applications, with a tab for heat dissipation.

SC Packages

SC-70: Compact, 3- or 5-pin for small transistors or ICs.
SC-89: Smaller footprint for low-power devices.

Integrated Circuits (ICs)

SOIC (Small Outline Integrated Circuit):
- SOIC-8, SOIC-16: Common for op-amps, microcontrollers (8–16 pins).
- Narrow (3.9 mm) or wide (7.5 mm) body variants.
SSOP (Shrink Small Outline Package): Smaller pitch than SOIC, e.g., SSOP-20.
TSSOP (Thin Shrink Small Outline Package): Thinner, finer pitch, e.g., TSSOP-16.
QFP (Quad Flat Package):
- LQFP (Low-profile QFP): 32–144 pins, common in microcontrollers.
- TQFP (Thin QFP): Thinner, for compact designs.
QFN (Quad Flat No-leads): 8–64 pins, no leads, small footprint, good thermal performance.
DFN (Dual Flat No-leads): Similar to QFN but with two rows of pads, e.g., DFN-6.
BGA (Ball Grid Array): High-density ICs (e.g., microprocessors), with solder balls underneath.

Other Common Packages

TO-252 (DPAK): Surface-mount power transistors or regulators.
TO-263 (D2PAK): Larger power devices with a metal tab.
MLF (Micro Lead Frame): Similar to QFN, used for sensors or small ICs.
CLCC (Ceramic Leadless Chip Carrier): For high-reliability applications.

Notes

Size Codes: Metric codes (e.g., 0603 = 1.6 x 0.8 mm) are sometimes used interchangeably with imperial codes, but metric is more precise.
Application-Specific: Package choice depends on power, size, and thermal requirements. For example, QFN/BGA for high-density ICs, chip packages for passives.
Standards: JEDEC and IEC define most package standards for consistency.

Last edited by Christian Grieger on 2025-04-24

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